Co-Packaged Optics (CPO) is a technology and design approach where optical components, such as lasers and photodetectors, are integrated alongside electrical components, like Application-Specific Integrated Circuits (ASICs), within the same package. CPO revolutionizes data center design by integrating optics and electronics, leading to improvements in power efficiency and bandwidth density. As applications like AI and machine learning become more prevalent, demanding higher bandwidth data processing capabilities, CPO technology provides a. That playbook is no longer holding for today's AI systems. As AI clusters push beyond 100 Tb/s per node, the gap between what silicon can generate and what traditional copper interconnects can deliver is widening fast. But after nearly a decade of existence, where does this next-generation optical. Co-packaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy eficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. This study presents an overview of CPO, highlighting its.
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