Yole Group unveils its latest photonic market and technology analyses, Silicon Photonics 2025 and Co-Packaged Optics for Data Centers 2025, which explore how AI-driven demand is reshaping connectivity, from transceivers to packaging innovation. Even as SerDes speeds increase, copper-based links struggle to deliver the required bandwidth per watt, once equalization and retiming overheads are factored in. Third, distance itself has become a problem: latency, energy per bit, and signal integrity degrade sharply with electrical reach. These. OFC 2025 made one thing clear: The transition to Co-Packaged Optics (CPO) switches in data centres is inevitable, driven primarily by the power savings they offer. From Jensen Huang showcasing CPO switches at GTC 2025 to a wide range of vendors demonstrating optical engines integrated inside ASIC. IDTechEx's report titled "Co-Packaged Optics (CPO) 2026 to 2036: Technologies, Market, and Forecasts" examines this transition in detail. It reviews recent advances in CPO technology, tracks emerging packaging approaches, assesses the strategies of leading companies, and provides long term market. Co-packaged optics frees the flow of data, advancing AI and pushing a new digital age. CPO is widely regarded as a promising.