DBC-based Embedded Micro-channel Cooler for the High-Power
Thermal limitation is a critical constraint on the power density of the power modules.
Get QuoteRelated Topics:
High Density Micromodules
Going Dense with Micromodule Cables
Micromodule cables are high-density optical cables with several individual micromodules as opposed to loose tubes in conventional cables. The micromodules typically include optical fibers
Get Quote
High inductance density in CMOS-compatible magnetically
This work establishes a new design paradigm for high-density microinductors, addressing the critical need for ultracompact RF electronics in emerging IoT and 5G/6G applications.
Get Quote
Pushing Module Power Density to the Limit
Full Silicon Carbide (SiC) MOSFET modules have clear performance benefits, especially where high power density is required, but how to achieve the highest possible power density?
Get Quote
Design and Fabrication of Embedded Microchannel Cooling
The rapid development of high-power-density semiconductor devices has rendered conventional thermal management techniques inadequate for handling their extreme heat fluxes.
Get Quote
Thermoelectric micro modules for spot cooling of high density heat
The paper represents further progress in the development of short-legged thermoelectric (TE) micro modules for cooling high power density electronic components.
Get Quote
Chip-Embedded Technology Enables High Current Density Power
DC-DC power modules in the past 10 years have evolved into new emerging, chip embedded technologies with newly enhanced thermal packaging techniques that allow for higher
Get Quote
Thermal management of 3-D heterogeneously integrated
While such integrated circuits offer significant improvements in functionality and integration density, the compact and vertical stacking of heterogeneous components introduce
Get Quote
High power density thermal management of discrete semiconductor
Discrete-packaged wide bandgap (WBG) semiconductor devices provide a flexible and cost-effective solution for scalable highly dense power electronics. However, their utilization at high
Get Quote
Chip-Embedded Technology Enables High Current
DC-DC power modules in the past 10 years have evolved into new
Get Quote
Power module package types and their benefits
QFN modules offer high power density and strong performance features that make them a well-rounded choice for many applications. There are two popular package configurations in the QFN module
Get Quote
High inductance density in CMOS-compatible
This work establishes a new design paradigm for high-density microinductors, addressing the critical need for ultracompact RF electronics in
Get Quote